Method for manufacture of printed circuit boards

Details Method for manufacture of printed circuit boards Method for manufacture of printed circuit boards

1993-12-06

1994-10-25

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156666, 156668, 156902, 428209, 428901, 427304, 427307, B44C 122, B29C 3700, C23F 100

Patent

active

053586026

ABSTRACT:
A method for the manufacture of printed circuit boards is provided comprising conditioning the board, activating with a catalytic metal, post-activating, stabilizing and etching the copper surfaces before the desired circuit is formed on the board. This process eliminates the need for a flash coating of copper in the through holes before the use of protective coatings such as imaging resists and soldermasks.

REFERENCES:
patent: 3011920 (1961-12-01), Shipley, Jr.
patent: 3099608 (1963-07-01), Radovsky et al.
patent: 4171225 (1979-10-01), Molenaar et al.
patent: 4895739 (1990-01-01), Bladon
patent: 4933010 (1990-06-01), Okabayashi
patent: 5158645 (1992-10-01), Covert et al.
patent: 5213841 (1993-05-01), Gulla et al.
Autocatalytic Deposition of Tin, A. Molenaar and J. W. G. deBakker, Philips Research Laboratories, 5600 JA Eindhoven, The Netherlands, J. Electrochem. Soc., vol. 136, No. 2, Feb. 1989, pp. 378-382.
Electroplating, Federick A. Lowenheim, McGraw-Hill Book Company, pp. 404-405 and 418-423.

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