Method for manufacture of multilayer circuit board

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

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430315, 430319, G03C 516

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active

049026100

ABSTRACT:
The invention is for the formation of multilayer circuit boards where layers are formed sequentially using selective plating techniques and photoimaging of permanent dielectric materials to achieve fine line resolution and interconnections between circuits. The invention permits the sequential formation of multilayers of higher density using photoimaging techniques.

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Bolda et al., "Multilayer Circuit Fabrication", IBM Tech. Discl. Bulletin, vol. 13, No. 11, Apr. 1971, p. 3429.
"Four Strategies", Electronic Business, Aug. 1984, p. 90.

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