Method for manufacture of multilayer circuit board

Details Method for manufacture of multilayer circuit board Method for manufacture of multilayer circuit board

1990-01-09

1993-09-21

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430315, 430319, G03G 516

Patent

active

052468178

ABSTRACT:
The invention is for the formation of multilayer circuit boards where layers are formed sequentially using selective plating techniques and imaging of dielectric materials to achieve fine line resolution and interconnections between circuits. The invention permits the sequential formation of multilayers of higher density using imaging techniques.

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patent: 4469777 (1984-09-01), O'Neil
patent: 4554229 (1985-11-01), Small
patent: 4572764 (1986-02-01), Fan
patent: 4737446 (1988-04-01), Cohen et al.
patent: 4782007 (1988-11-01), Ferrier
patent: 4795693 (1989-01-01), Ors et al.
patent: 4897338 (1990-01-01), Spicciati et al.
patent: 4921777 (1990-05-01), Fraenkel et al.

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