Method for manipulating the topography of a film surface

Details Method for manipulating the topography of a film surface Method for manipulating the topography of a film surface

2007-10-09

2007-10-09

Duda, Kathleen (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

C430S030000

Reexamination Certificate

active

10644356

ABSTRACT:
A method for selectively altering a thickness of a radiation sensitive polymer layer including providing a substrate including at least one radiation sensitive polymer layer having a first thickness topography; exposing the at least one radiation sensitive polymer layer through a mask having a predetermined radiant energy transmittance distribution to selectively expose predetermined areas of the at least one sensitive polymer layer to predetermined radiant energy dosages; and, developing the at least one radiation sensitive polymer layer to alter the first thickness topography of the at least one radiation sensitive polymer layer to produce a second thickness topography.

REFERENCES:
patent: 3889355 (1975-06-01), Aronstein et al.
patent: 4333794 (1982-06-01), Beyer et al.
patent: 4822722 (1989-04-01), Lewis et al.
patent: 6064466 (2000-05-01), Sato et al.

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