Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-03-21
2006-03-21
Pert, Evan (Department: 2826)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S614000
Reexamination Certificate
active
07015130
ABSTRACT:
A method for making UBM (Under Bump Metallurgy) pads and bumps on a wafer is disclosed. Openings are formed in a photoresist layer for forming bumps, a positive liquid photoresist is provided into the openings of the photoresist layer for forming bumps. The positive liquid photoresist is exposed and developed to modify the openings of the photoresist layer. Thus, bumps formed in the modified openings have precise bonding areas on the UBM layer. Using the bumps as a mask, UBM pads under the bumps are formed by etching the UBM layer, so that the reflowed bumps have a uniform height.
REFERENCES:
patent: 5057453 (1991-10-01), Endo et al.
patent: 5904859 (1999-05-01), Degani
patent: 6130141 (2000-10-01), Degani et al.
patent: 2004/0259345 (2004-12-01), Yu et al.
Hong-Zen Yang
Huang Min-Lung
Tsai Chi-Long
Weng Chao-Fu
Wu En-Chieh
Advanced Semiconductor Engineering Inc.
Dennison Schultz Dougherty & MacDonald
Pert Evan
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