Method for making semiconductor device

Details Method for making semiconductor device Method for making semiconductor device

1981-02-23

1982-12-07

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29576E, 29580, 156657, 1566591, 1566611, 156662, H01L 21306

Patent

active

043625991

ABSTRACT:
A semiconductor device prepared by forming a silicon substrate of one conductor type having a surface of the (100) crystal plane, opening a rectangular window having sides parallel to the <100> crystal axis, etching the interior of the rectangular window with an anisotropic etching solution to form a dent, removing the oxide film and growing an epitaxial layer of a conductor type opposite to that of the substrate on the entire surface of the substrate, and masking the dent with an oxide film and etching the epitaxial layer with an anisotropic etching solution to flatten the surface of the epitaxial layer, and a method for making this semiconductor device.

REFERENCES:
patent: 4089021 (1978-05-01), Sato et al.

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