Plastic and nonmetallic article shaping or treating: processes – With step of making mold or mold shaping – per se
Reexamination Certificate
2005-02-22
2005-02-22
Ortiz, Angela (Department: 1732)
Plastic and nonmetallic article shaping or treating: processes
With step of making mold or mold shaping, per se
C264S259000, C264S275000, C264S278000
Reexamination Certificate
active
06858171
ABSTRACT:
In a method for making a stainless steel reinforced belt pad for linear chemical mechanical planarization (CMP), a stainless steel band is disposed around an inner mold having positioners configured to hold the stainless steel band in place during a molding process. Once the stainless steel band is disposed around the inner mold, pad material is injected into the gap defined between the outer mold and the stainless steel band. An inner mold for making a stainless steel reinforced belt pad for linear CMP includes a cylindrical body and a plurality of positioners affixed to the cylindrical body. The plurality of positioners is arranged so as to hold a stainless steel band disposed around the cylindrical body in place during a molding process. By way of example, suitable positioners include spring-loaded ball plungers.
REFERENCES:
patent: 4223430 (1980-09-01), Sherlaw
patent: 4563323 (1986-01-01), Breher
patent: 5169581 (1992-12-01), Ickinger et al.
patent: 5219505 (1993-06-01), Kaiser
patent: 5695705 (1997-12-01), Halket et al.
patent: 5893796 (1999-04-01), Birang et al.
patent: 6383438 (2002-05-01), Yagi
patent: 6696005 (2004-02-01), Strasbaugh
Lam Research Corporation
Martine & Penilla LLP
LandOfFree
Method for making reinforced belt pad for linear chemical... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for making reinforced belt pad for linear chemical..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for making reinforced belt pad for linear chemical... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3462982