Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1981-04-02
1983-02-08
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29831, 29841, 156634, 1566591, 156902, 174 685, 427 97, 428902, 430313, 430315, B44C 122, C03C 1500, C03C 2506, C23F 102
Patent
active
043728049
ABSTRACT:
The thickness of copper foil at the land formation area of a copper clad laminate of a miniaturized high density circuit is made thicker than the remaining area to assure high reliability of connection between the through hole plating and the land.
REFERENCES:
patent: 3374129 (1968-03-01), Boucher
patent: 3466206 (1969-09-01), Beck
patent: 3627902 (1971-12-01), Meyers
patent: 3688396 (1972-09-01), Kilby et al.
patent: 3947957 (1976-04-01), Luttmer
Hanabusa Takayoshi
Kurosawa Keiji
Umemoto Shinzi
Yamamoto Kenji
Yamashita Mitsuo
Fujitsu Limited
Powell William A.
Tick Daniel Jay
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