Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1991-06-18
1993-03-23
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156634, 156645, 1566591, 156656, 156902, B44C 122, C23F 100
Patent
active
051960877
ABSTRACT:
A multi-layer printed circuit board is disclosed as having more layers and greater accuracy in the conductive traces of those layers than has been previously possible. Using the disclosed method, multi-layer printed circuit boards can be built having a conductive path width of 0.5 mils (0.0127 mm) and spacing between such conductive traces of 0.5 mils (0.0127 mm). The method enables multi-layer boards to be created having more than eight layers, and still maintaining the desired 0.5 mil conductive path width and spacing. The enhanced accuracy and increased number of layers is made possible by use of adjustments to customer-supplied art work based upon evaluation of test pieces made early in the procedure. By use of the disclosed method, multi-layer printed circuit boards can be built having a high density of coaxial cable equivalents and tuned wave guide equivalents. An apparatus is also disclosed which connects the coaxial cable equivalents and tuned wave guide equivalents from one multi-layer printed circuit board to a second multi-layer printed circuit board.
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Multimedia Design, Inc.
Powell William A.
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