Method for making multi-layer circuit boards

Details Method for making multi-layer circuit boards Method for making multi-layer circuit boards

1995-09-06

1999-01-19

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

148272, 1563088, 156 39, 174259, 25218821, 427 98, 427305, 427343, 427437, 428626, 428637, 428687, B32B 3100

Patent

active

058610766

ABSTRACT:
The present invention relates to a bond enhancement process for promoting strong, stable adhesive bonds between surfaces of copper foil and adjacent resin impregnated substrates or superimposed metallic sublayers. According to the process of the invention, a black oxide-coated copper surface is treated with an aqueous reducing solution containing sodium metabisulfite and sodium sulfide to convert the black oxide coating to a roughened metallic copper coating. The roughened metallic copper-coated surface is then passivated and laminated to a resin impregnated substrate. The bond enhancement process is especially useful in multilayer printed circuit fabrication and in the treatment of copper circuit lines and areas which are disconnected from each other, that is, which do not have electrically conductive continuity. Inner-layer laminates prepared according to the process of the invention are not susceptible to pink-ring formation, exhibit excellent resistance to chemical attack at drilled holes and sheared edges and are stable under thermal and mechanical stresses.

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