Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1993-10-14
1994-12-06
Powell, William
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156651, 1566591, 156663, 359365, 359619, 430321, 430323, 430330, B44C 122, H01L 21306, C03C 1500, C03C 2506
Patent
active
053707680
ABSTRACT:
Prior to the production of microlenses (29) by the reactive ion etch technique, a pattern of notches (25) is formed in a second surface of a substrate (11) opposite a first surface on which the microlenses (29) are to be formed. Reactive ion etching of the first surface to produce the microlenses is sufficiently deep to reach the pattern of notches, thereby to separate the substrate. The array of notches may define, for example, an array of first areas (26) on the second surface, each area being surrounded by a notch. Photoresist elements (28) are then each located on an area of the first surface corresponding to a first area of the second surface, so that the separation separates the substrate into a plurality of segments (26) each containing only one of the microlenses (29). The notches can be made such that each of the segments (26) is cylindrical so that each of the microlenses formed from the substrate has a circular outer periphery.
REFERENCES:
patent: 4530736 (1985-07-01), Mutter
patent: 4813762 (1989-03-01), Leger et al.
patent: 5079130 (1992-01-01), Derkits, Jr.
patent: 5286338 (1994-02-01), Feldblum et al.
"A Process for Monolithic Fabrication of Microlenses on Integrated Circuits," by Z. D. Popovic et al., SPIE, vol. 989 Miniature Optics and Lasers (1988), pp. 23-25.
"Ion-Beam Etching of InP and Its Applications to the Fabrication of High Radiance InGasAsP/InP Light Emitting Diodes," by O. Wada, Journal of Electrochemical Society: Solid-State Science and Technology, Oct. 1984, vol. 131, No. 10, pp. 2373-2380.
Mersereau Keith O.
Nijander Casimir R.
Townsend Wesley P.
Anderson Roderick B.
AT&T Corp.
Powell William
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