Method for making high-frequency bipolar transistor

Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Self-aligned

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438371, 438378, 438348, 438350, 438368, H01L 21331

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059407115

ABSTRACT:
A process for forming a structure of a high-frequency bipolar transistor on a layer of a semiconductor material with conductivity of a first type. The process includes forming a first shallow base region by implantation along a selected direction of implantation and using a dopant with a second type of conductivity. The region extends from a first surface of the semiconductor material layer and encloses, toward said first surface, an emitter region with conductivity of the first type. In accordance with the invention, the implantation step includes at least one process phase at which the direction of implantation is maintained at a predetermined angle significantly greatly than zero degrees from the direction of a normal line to said first surface. Preferably, the implantation angle is of about 45 degrees.

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Warnock et al., "A Full E-Beam 0.25 .mu.m Bipolar Technology with sub-25 ps ECL Gate Delay," International Electron Devices Meeting: 16.6-16.6.3, Dec. 8-11, 1991.
Gomi et al., "A Sub-30psec Si Bipolar LSI Technology," International Electron Devices Meeting: 744-747, Dec. 11-14, 1988.
Isaac, et al., "Method for Fabricating A Self-Aligned Vertical PNP Transistor," IBM Technical Disclosure Bulletin,vol. 22 (8A), Jan. 1980.

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