Method for making heat-dissipating elements for micro-electronic

Powder metallurgy processes – Powder metallurgy processes with heating or sintering – Powder shape or size characteristics

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419 30, 419 39, 419 47, 75245, 75248, B22F 312

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active

054137519

ABSTRACT:
High density heatsinks for microcircuit packages are formed by first mold-pressing a composite powder of free-flowing spray-dried particles of copper and at least one other denser material such as tungsten and/or molybdenum, the proportions of which are adjusted to match the thermal expansion characteristics of the microcircuit material. The pressed compacts are then heated in a sintering furnace at 1,200.degree. C. to 1,350.degree. C. in order to effect an homogeneous distribution of the melting copper throughout the structure. The process results in a readily usable component having good thermal conductivity and matched thermal expansion that requires no further machining.

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Jones, W. D. "Fundamental Principles Powder Metallurgy", 1961, pp. 52-53, 232, 471-473.

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