4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Metallic housing or support

Vladimir Ocheretyansky

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Heat-dissipating package for microcircuit devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Heat-dissipating package for microcircuit devices and process fo

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Isotropic carbon/copper composites

Specialized metallurgical processes – compositions for use therei – Compositions – Consolidated metal powder compositions
Reexamination Certificate

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Method for making heat-dissipating elements for micro-electronic

Powder metallurgy processes – Powder metallurgy processes with heating or sintering – Powder shape or size characteristics
Patent

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Profile ID: LFUS-PAI-P-974474

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