Method for making flexible circuit card with laser-contoured via

Details Method for making flexible circuit card with laser-contoured via Method for making flexible circuit card with laser-contoured via

1990-01-11

1991-11-19

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156644, 156651, 156655, 156668, 156902, 21912169, 21912171, 2191218, B44C 122, B29C 3700

Patent

active

050663577

ABSTRACT:
A flexible circuit such as a membrane probe (10) is made by forming a trench (50, 60) in the upper surface (39) of a polyimide substrate (38) with a trench base (52, 62) spaced below the upper surface. The trench has an end wall (54, 64) ramped at an obtuse angle to the substrate upper surface and the trench base. A conductive layer deposited on the upper surface is patterned to form a line trace (44, 46) extending continuously over the substrate upper surface, down the ramped end wall and along the trench base, to contact a ground plane or form a distributed capacitance. An excimer laser is used, at a wavelength of 308 nm., an energy density less than 0.54 J./cm.sup.2 (preferably 0.18 to 0.35 J./cm.sup.2), and a pulse frequency of about 100 Hz., to ablate successive incremental thicknesses (80) of polyimide from the substrate in sweeps of depthwise decreasing length.

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