Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2008-07-22
2008-07-22
Smith, Zandra (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S125000, C438S126000, C257S702000, C257S701000, C257SE23116
Reexamination Certificate
active
07402457
ABSTRACT:
A film, based on polyimide or epoxy, is laminated onto a surface of a substrate under a vacuum, so that the film closely covers the surface and adheres thereto. Contact surfaces to be formed on the surface are uncovered by opening windows in the film. A contact is established in a plane manner between each uncovered contact surface and a layer of metal. This establishes a large-surface contact providing high current density for power semiconductor chips.
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Amigues Laurence
Häse Kerstin
Rebhan Matthias
Schwarzbauer Herbert
Seliger Norbert
Novacek Christy L
Siemens Aktiengesellschaft
Smith Zandra
Staas & Halsey , LLP
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