Method for making bumps

Details Method for making bumps Method for making bumps

1997-12-09

1999-08-31

Picardat, Kevin M.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438612, 438614, H01L 2144

Patent

active

059465905

ABSTRACT:
A bump is formed on a semiconductor wafer which has a pad electrode thereon. The method includes the steps for coating a first organic film on a semiconductor water; drying the first organic film; applying an excimer laser to a portion of the first organic film substantially corresponding to the pad electrode to thereby form a first opening in the organic film; forming at least one metallic film on the first organic film and the opening; coating a second organic film on the metallic film; drying the second organic film; applying an excimer laser to a portion of the second organic film substantially corresponding to the first opening to thereby form a second opening in the second organic film; and providing and melting solder at the second opening to form a solder bump. Since the openings of the organic films are formed by the excimer laser, the openings can be formed in a short time with high accuracy. Thus, the bump with high quality can be formed at a low cost.

REFERENCES:
patent: 4950623 (1990-08-01), Dishon
patent: 5137845 (1992-08-01), Lochon et al.
patent: 5376584 (1994-12-01), Agarwala

Affiliated with

Also associated with

Rating

Method for making bumps does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for making bumps, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for making bumps will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2428720