Method for making an anisotropic conductive polymer film on...

Details Method for making an anisotropic conductive polymer film on... Method for making an anisotropic conductive polymer film on...

2006-04-11

2006-04-11

Le, Dung A. (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S672000, C438S673000, C438S638000

Reexamination Certificate

active

07026239

ABSTRACT:
A method of manufacturing an anisotropic conductive polymer film on a semiconductor wafer including on one surface a layer of passivation in which at least one opening is made to allow access to a contact pad. The method can be applied to creating components (chips, integrated circuits) with high-density interconnections.

REFERENCES:
patent: 5543585 (1996-08-01), Booth et al.
patent: 5879530 (1999-03-01), Caillat
patent: 6803303 (2004-10-01), Hiatt et al.
patent: 2001/0013661 (2001-08-01), Yamaguchi et al.
patent: 99/05717 (1999-02-01), None
Jean-Charles Souriau, et al., “Electrical Conductive Film for Flip-Chip Interconnection Based on Z-axis Conductors”, Electronic Components and Technology Conference, pp. 1151-1153 2002.

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