Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1987-06-29
1990-09-25
Nguyen, Nam X.
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20419216, C23C 1434
Patent
active
049591363
ABSTRACT:
Disclosed herein is a method for producing an amorphous aluminum nitride layer having a desired stoichiometry. Such method involves the steps of disposing a substrate in close proximity to an aluminum target in a low pressure atmosphere of nitrogen and an inert gas, and reactive sputtering an aluminum nitride layer onto the substrate at a certain minimum deposition rate while maintaining certain parameters (i.e. nitrogen-to-inert gas ratio, substrate temperature, sputtering power, nitrogen flow rate and sputtering pressure) within certain limits.
REFERENCES:
patent: 3461054 (1969-08-01), Vratny
patent: 3600218 (1971-08-01), Pennebaker
patent: 4082040 (1978-04-01), Yamashina et al.
patent: 4384933 (1983-05-01), Takasaki
Eastman Kodak Company
Kurz Warren W.
Nguyen Nam X.
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