Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-03-28
2010-06-22
Garber, Charles D (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S107000, C438S118000, C438S612000, C257SE21480, C257SE21499, C257SE21509
Reexamination Certificate
active
07741208
ABSTRACT:
A wedge wedge wire loop is formed with the steps:a) lowering the capillary onto the first connection point and applying a predefined bond force and ultrasound for producing a wedge connection on the first connection point,b) raising the capillary by a predetermined distance D1in an essentially vertical direction,c) moving the capillary laterally and downwards in order to bend the wire and press it against the wedge connection,d) raising the capillary and moving the capillary in order to form a wire loop and to attach the wire to the second connection point, ande) tearing off the wire.
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Mattmueller Jan
Seidel Marit
Garber Charles D
Lee Cheung
McCormick Paulding & Huber LLP
Oerlikon Assembly Equipment Ltd.
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