Method for making a wafer-pair having sealed chambers

Details Method for making a wafer-pair having sealed chambers Method for making a wafer-pair having sealed chambers

2006-06-27

2006-06-27

Ryan, Patrick (Department: 1745)

Etching a substrate: processes

Etching of semiconductor material to produce an article...

C438S054000, C438S456000, C438S703000, C438S700000, C204S192350, C204S192370, C216S024000, C216S033000, C216S039000, C216S056000

Reissue Patent

active

RE039143

ABSTRACT:
A method for fabricating a wafer-pair having at least one recess in one wafer and the recess formed into a chamber with the attaching of the other wafer which has a port plugged with a deposited layer on its external surface. The deposition of the layer may be performed in a very low pressure environment, thus assuring the same kind of environment in the sealed chamber. The chamber may enclose at least one device such as a thermoelectric sensor, bolometer, emitter or other kind of device. The wafer-pair typically will have numerous chambers, with devices, respectively, and may be divided into a multiplicity of chips.

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