Method for making a thin profile semiconductor package

Details Method for making a thin profile semiconductor package Method for making a thin profile semiconductor package

1994-03-28

1996-05-21

Fourson, George

Fishing, trapping, and vermin destroying

437212, 437216, 437217, 22818022, H01L 21283, H01L 2156, H01L 2158, H01L 21603

Patent

active

055189571

ABSTRACT:
A process for manufacturing a thin profile semiconductor package by means of TAB (tape automated bonding). A barrier metal layer is formed on bonding pads formed on portions of a chip covered with insulating layers. A photoresist layer is formed on the resultant structure, and patterned so as to expose the barrier metal layer, and then bumps are formed on the barrier metal layer as high as the photoresist layer. The semiconductor package is completed by bonding the bumps and inner lead portions of the TAB tape. The photoresist remains on the completed package as a permanent protective layer.

REFERENCES:
patent: 3537175 (1970-11-01), St. Clair et al.
patent: 3711625 (1973-01-01), Dupuis
patent: 3868724 (1975-02-01), Perrino
patent: 4328262 (1982-05-01), Kurahashi et al.
patent: 4908689 (1990-03-01), McBride et al.
patent: 5136367 (1992-08-01), Chiu
IBM TDB, Inner Lead Bonding for TAB Package, vol. 33 No. 3A, Aug. 1990, pp. 375-376.

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