Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1987-11-20
1989-08-29
Simmons, David
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
29603, 51165R, 156154, 360126, G11B 5127
Patent
active
048613983
ABSTRACT:
DC bias currents are applied to a conducting wire of a thin film magnetic head to be inspected. When the DC bias currents (I.sub.0, I.sub.1, I.sub.2) are supplied to the conducting wire, the impedances (Z.sub.0, Z.sub.1, Z.sub.2) corresponding to the DC bias currents are measured. When a ratio (.vertline.Z.sub.1 -Z.sub.0 .vertline./.vertline.Z.sub.2 -Z.sub.0 .vertline.) corresponding to an overwrite characteristic (OW) reaches to a predetermined value by lapping tip portions of an upper magnetic layer and a lower magnetic layer of the magnetic head, the lapping process of the magnetic head is finished.
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Aihara Makoto
Fukuoka Hirotsugu
Isono Yukihiro
Kawakami Kanji
Suda Mitsuo
Hitachi , Ltd.
Simmons David
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