Method for making a surface acoustic wave device package

Details Method for making a surface acoustic wave device package Method for making a surface acoustic wave device package

2007-02-16

2008-12-02

Ahmed, Shamim (Department: 1792)

Etching a substrate: processes

Etching of semiconductor material to produce an article...

C216S041000, C216S083000, C438S689000, C438S745000

Reexamination Certificate

active

07459094

ABSTRACT:
A method for making a SAW device package includes the steps of: forming a pattern of a metal layer, that defines transmitting and receiving transducers of a SAW die, on a wafer; forming a pattern of a first photo sensitive layer, which defines a peripheral wall of a cap of the SAW die, on the metal layer and the wafer through lithography techniques; forming a pattern of a second photo sensitive layer, which defines a cover wall of the cap of the SAW die, on the first photo sensitive layer through lithography techniques; curing the first and second photo sensitive layers; dicing the wafer into SAW dies; and encapsulating the SAW dies with a molding compound.

REFERENCES:
patent: 6855637 (2005-02-01), Yamashita et al.
patent: 2004/0207491 (2004-10-01), Nakaya et al.

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