Method for making a silicon dioxide layer on a silicon substrate

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation

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438591, 438594, 438770, 205157, 205333, H01L 21316

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active

057364540

ABSTRACT:
The present invention relates to a method for forming a silicon dioxide layer on a silicon substrate, which is suitable for use as a thin-gate oxide. The method includes conducting an electrolytic reaction at a room temperature such that a silicon dioxide layer is formed on a silicon substrate acting as an anode, wherein pure water is used as an electrolyte of the electrolytic reaction. The silicon dioxide layer is further subjected with a rapid thermal densification carried out in an inert gas atmosphere and at a temperature of 700.degree.-1000.degree. C. for a period of time such that the silicon dioxide layer formed on said silicon substrate is densified.

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patent: 3764491 (1973-10-01), Schwartz
patent: 3890169 (1975-06-01), Schwartz
patent: 4289602 (1981-09-01), Sansregret
Thin-Gate Oxides Prepared by Pure Wter Anodization Followed by Rapid Thermal Densification, Jeng et al., IEEE Electronic Device Letters, vol. 17, No. 12, Dec. 1996, pp. 575-577.
Enhanced nitrogen incorporation and improved breakdown endurance in nitrided gate oxides preparede by anodic oxidation followed by rapid thermal nitridation in N.sub.2 O, Jeng et al., Appl. Phys. Lett. 69(25), 16 Dec. 1996, pp. 1-3.

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