Method for making a semiconductor multi-package module...

Details Method for making a semiconductor multi-package module... Method for making a semiconductor multi-package module...

2007-07-23

2009-02-24

Chambliss, Alonzo (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S122000, C257S685000, C257S686000, C257S724000, C257S784000, C257S025000, C257S023000

Reexamination Certificate

active

07494847

ABSTRACT:
A semiconductor multi-package module has stacked lower and upper packages, each of which includes a die attached to a substrate, in which the second package is inverted, in which the upper and lower substrates are interconnected by wire bonding, and in which the inverted second package comprises a wire bond carrier package. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a die, affixing an upper wire bond carrier package including an upper substrate in inverted orientation onto the upper surface of the lower package, and forming z-interconnects between the upper and lower substrates.

REFERENCES:
patent: 5903049 (1999-05-01), Mori
patent: 6762488 (2004-07-01), Maeda et al.
patent: 6919626 (2005-07-01), Burns
patent: 6933598 (2005-08-01), Karnezos
patent: 7101731 (2006-09-01), Karnezos
patent: 7163842 (2007-01-01), Karnezos
patent: 7247519 (2007-07-01), Karnezos et al.

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