Method for making a semiconductor acceleration sensor

Details Method for making a semiconductor acceleration sensor Method for making a semiconductor acceleration sensor

1998-01-14

1999-11-23

Vincent, Sean

Glass manufacturing

Processes

Fusion bonding of glass to a formed part

65 40, 65 42, 65 43, 65 58, 65 591, C03C 2700

Patent

active

059879211

ABSTRACT:
A semiconductor acceleration sensor has a silicon detecting body and a glass substrate. The silicon detecting body has a weight, a supporting frame, and beams for coupling the weight to the supporting frame, which are integrally processed from a silicon wafer. At least one semiconductor strain gauge is formed on a surface of a beam. The glass substrate is electrostatically joined with the supporting frame of the silicon detecting body. Furthermore, a gap portion is formed between a surface of the glass substrate and a lower surface of the weight.

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