Method for making a pattern using near-field light exposure...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

Reexamination Certificate

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C430S313000, C430S005000

Reexamination Certificate

active

07144685

ABSTRACT:
A method of forming a latent image pattern in a photoresist film by providing a photomask for near-field light exposure that includes a transparent support and a shading member having a pattern of at least two apertures with different widths not greater than the wavelength of light from a light source. The shading member has a constant thickness that is set such that differences between light intensities directly below each of the apertures of different widths are 20% or less based on a largest light intensity of the light intensities directly below each of the apertures. The method includes placing the photomask on the photoresist film and irradiating with light from the light source. For manufacturing a semiconductor device, the method further includes developing a photoresist pattern from the latent image in the photoresist film on a silicon substrate and transferring the photoresist pattern onto the silicon substrate by etching.

REFERENCES:
patent: 6187482 (2001-02-01), Kuroda et al.
patent: 6338924 (2002-01-01), Tsuruma et al.
patent: 2001/0046719 (2001-11-01), Yamaguchi et al.
patent: 1 150 162 (2001-10-01), None
patent: 8-179493 (1996-07-01), None
patent: 2000-314955 (2000-11-01), None
patent: 2001-5168 (2001-01-01), None

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