Method for making a microelectronic package using...

Details Method for making a microelectronic package using... Method for making a microelectronic package using...

2007-12-18

2007-12-18

Ahmed, Shamim (Department: 1765)

Etching a substrate: processes

Forming or treating an ornamented article

Treating elemental metal or alloy thereof

C216S041000, C216S083000, C216S100000, C264S319000

Reexamination Certificate

active

10771252

ABSTRACT:
A method for making a reusable mold for forming a microelectronic element package. The method including the steps of removing material from portions of a base to form recesses in the base and then depositing a mask material on at least some portions of the base.

REFERENCES:
patent: 4567123 (1986-01-01), Ohtaka et al.
patent: H000788 (1990-06-01), Schneider, Jr.
patent: 5325583 (1994-07-01), Shimizu et al.
patent: 5633529 (1997-05-01), Otsuki
patent: 6285086 (2001-09-01), Sota et al.
patent: 6537459 (2003-03-01), Dufresne et al.
patent: 03-251395 (1991-11-01), None
patent: 2002-321337 (2002-11-01), None

Affiliated with

Also associated with

Rating

Method for making a microelectronic package using... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for making a microelectronic package using..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for making a microelectronic package using... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3886314