Method for machining surfaces of semiconductor substrates

Details Method for machining surfaces of semiconductor substrates Method for machining surfaces of semiconductor substrates

1977-04-14

1978-08-22

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

148187, 156655, 156662, H01L 21312

Patent

active

041087151

ABSTRACT:
A surface of a semiconductor substrate is coated with a mask having a desired doping pattern and the ions of a desired element are accelerated using the mask so that the structure of a predetermined region is changed. Thereafter the doped region or the region not doped is etched and removed.

REFERENCES:
patent: 2989385 (1961-06-01), Gianola et al.
patent: 3976511 (1976-08-01), Johnson
patent: 4026740 (1977-05-01), Owen

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