Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-12-27
2005-12-27
Le, Thao P. (Department: 2818)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S623000
Reexamination Certificate
active
06979639
ABSTRACT:
Methods for making electronic devices where a molecular monolayer or multilayer is sandwiched between top and bottom electrodes at electrode intersections. The molecular layer has an electrical characteristic such as bistable switching. A layer of electrically conductive material is used to protect the molecular layer during formation of the top electrode pattern. The electrically conductive material remains sandwiched between the top and bottom electrodes at the electrode intersections in the final electronic device.
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Beck Patricia A.
Collier Charles P.
DeIonno Erica
Heath James R.
Luo Yi
California Institute of Technology
Hewlett-Packard Development Co. L.P.
Le Thao P.
Shapiro & Dupont LLP
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