Method for liquid phase epitaxy multiple dipping of wafers for b

Details Method for liquid phase epitaxy multiple dipping of wafers for b Method for liquid phase epitaxy multiple dipping of wafers for b

1979-03-02

1981-01-06

Lutter, Frank W.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156DIG98, 23301, C30B 1904

Patent

active

042434726

ABSTRACT:
A method for batch processing wafers by liquid phase epitaxy (LPE) dipping methods for uniformity of film thickness wafer-to-wafer and uniformity of film on each individual wafer for use in bubble (domain) memories comprising, supporting a plurality of wafers substantially horizontal on a substrate holder and lowering and immersing said wafers into the melt to be deposited as a thin film on each wafer and, while immersed, continually moving the wafers up and down as well as continually oscillating the wafers through substantially 360.degree..

REFERENCES:
patent: 2793941 (1957-05-01), Estes
patent: 3647578 (1972-03-01), Barnett et al.
patent: 3677718 (1972-07-01), Lawless
patent: 4077832 (1978-03-01), Robertson et al.
patent: 4092208 (1978-05-01), Brice et al.
patent: 4191365 (1980-03-01), O'Neill

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