Method for laser processing of wafer

Details Method for laser processing of wafer Method for laser processing of wafer

2008-07-08

2008-07-08

Vu, David (Department: 2818)

Semiconductor device manufacturing: process

Radiation or energy treatment modifying properties of...

C438S795000, C438S033000, C438S068000, C257SE21599

Reexamination Certificate

active

11261600

ABSTRACT:
A method of carrying out the laser processing of a wafer with a laser beam processing machine comprising a chuck table for holding a wafer, a laser beam application means for applying a laser beam to the wafer held on the chuck table and a processing-feed means for processing-feeding the chuck table and the laser beam application means relative to each other, comprising the steps of a wafer affixing step for putting the wafer on the surface of a protective tape mounted on an annular frame, a wafer holding step for holding the wafer put on the protective tape on the chuck table, and a laser beam application step for applying a laser beam having a predetermined wavelength from the laser beam application means to the wafer held on the chuck table and processing-feeding the wafer with the processing-feed means, wherein the protective tape is made of a material which transmits the laser beam having a predetermined wavelength applied from the laser beam application means.

REFERENCES:
patent: 6184109 (2001-02-01), Sasaki et al.
patent: 6580054 (2003-06-01), Liu et al.
patent: 2004/0164061 (2004-08-01), Takeuchi et al.
patent: 2006/0035444 (2006-02-01), Nakamura et al.
patent: 2003-320466 (2003-11-01), None

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