Method for laser-induced removal of a surface coating

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156668, 219121LM, B44C 122, B23K 2600

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active

046718486

ABSTRACT:
In order to remove a dielectric coating from a conducting material, a high energy radiation source, such as a laser source, is focused in a region having a predefined relationship with the coating of the conducting material. The focused radiation results in a plasma or ionized region being formed. The coating in the vicinity of the plasma region is removed. The region of the focusing of the radiation is varied spatially to remove the dielectric coating in a pre-selected region of the conducting material. According to one embodiment, the radiation is focused in a region spatially removed from the conducting material in order that the direct radiation does not directly impact the conducting material.

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Missel et al., "Improvement of Removal Characteristic of Wire Insulation", IBM Tech. Discl. Bulletin, vol. 12, No. 7, Dec. 1969, p. 979.
Piggin, B. P., "Use of Laser to Remove Insulation", IBM Tech. Discl. Bulletin, vol. 11, No. 7, Dec. 1968, p. 872.
Steinfeld et al., "Surface Etching by Laser-Generated Free Radicals", Journal of the Electrochemical Society, vol. 127, No. 2, Jan. 1980, pp. 514, 515.
Iceland, William, "Laser Wire Stripping: Equipment and Operation Notes", Insulation/Circuits, Apr. 1980, pp. 47-50.
Brewer et al., "Laser-Assisted Dry Etching", Solid State Technology, Apr. 1985, pp. 273-278.

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