Method for joining a semiconductor chip to a chip carrier substr

Details Method for joining a semiconductor chip to a chip carrier substr Method for joining a semiconductor chip to a chip carrier substr

1995-05-03

2000-12-19

Chaudhuri, Olik

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438615, 22818022, H01L 2144

Patent

active

061626600

ABSTRACT:
A method for joining a semiconductor integrated circuit chip in a flip chip configuration, via solder balls, to solderable metal contact pads, leads or circuit lines on the circuitized surface of an organic chip carrier substrate, as well as the resulting chip package, are disclosed. The inventive method does not require the use of a solder mask, does not require the melting of the bulk of any of the solder balls and does not require the use of a fluxing agent.

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