Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-11-27
2007-11-27
Baumeister, B. William (Department: 2891)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S099000, C438S197000, C257SE21041, C257SE21575
Reexamination Certificate
active
10875480
ABSTRACT:
An improved method of interconnecting electronic devices is described. In the method a blended material for forming a conducting layer and an insulating layer are deposited between a contact of a first electronic device and a second electronic device. The blended material leads to formation of a conductor overlayed by an insulator such that after formation, the conductor is capable of carrying current from the first electronic device to the second electronic device and the insulator forms a protective layer over the conductor.
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Anya Igwe U.
Baumeister B. William
Chen Kent
Palo Alto Research Center Incorporated
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