Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making named article
Reexamination Certificate
2006-02-07
2006-02-07
Barreca, Nicole (Department: 1756)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making named article
C430S311000, C430S313000, C430S315000, C430S319000, C430S329000
Reexamination Certificate
active
06994950
ABSTRACT:
MEMs devices are integrally fabricated with included micro or nanoparticles by providing a mixture of a sacrificial material and a multiplicity of particles, disposing the mixture onto a substrate, fabricating a MEMs structure on the substrate including at least part of the mixture, so that at least some of the mixture is enclosed in the MEMs structure, removing the sacrificial material, and leaving at least some of the multiplicity of particles substantially free and enclosed in the MEMs structure. The step of fabricating a MEMs structure is quite general and is contemplated as including one or a multiplicity of additional steps for creating some type of structure in which the particles, which may be microbeads or nanobeads, are included. A wide variety of useful applications for MEMs integrated with micro or nanoparticles are available.
REFERENCES:
patent: 5364497 (1994-11-01), Chau et al.
patent: 5374449 (1994-12-01), Buhlmann et al.
patent: 5474808 (1995-12-01), Aslam
patent: 5600197 (1997-02-01), Takeuchi et al.
patent: 5679436 (1997-10-01), Zhao
patent: 6046659 (2000-04-01), Loo et al.
patent: 6478974 (2002-11-01), Lebouitz et al.
patent: 2002/0020053 (2002-02-01), Fonash et al.
He Qing
Tai Yu-Chong
Barreca Nicole
California Institute of Technology
Foley & Lardner LLP
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