Method for integrated mass flow controller fabrication

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive

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438 52, 438455, H01L 21308

Patent

active

060636459

ABSTRACT:
A manufacturing method of an integrated mass flow controller (MFC) module is disclosed. The integrated MFC module is comprising top, middle and bottom parts. The middle part of the integrated MFC module which is consist of both the microvalve and sensing regions that is the key feature of the present invention. The microvalve is formed by depositing a heating element in a microbridge suspended on a mesa to control the movement of the valve. On the other hand, a series of sensing elements of the sensing region are in the mass flow path to detect the mass flow. The top and bottom parts are used for mass flow channel, mass entrance, mass exit and signal output terminals. There are bumps in the interface between middle and bottom parts to support the microvalve mesa. All three parts are first fabricated on a semiconductor wafer separately and then engaged together to complete the integrated MFC module formation.

REFERENCES:
patent: 4808009 (1989-02-01), Sittler et al.
patent: 5201221 (1993-04-01), Forgacs et al.
patent: 5994160 (1999-11-01), Niederman et al.

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