Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Patent
1998-06-15
2000-05-16
Fourson, George
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
438 52, 438455, H01L 21308
Patent
active
060636459
ABSTRACT:
A manufacturing method of an integrated mass flow controller (MFC) module is disclosed. The integrated MFC module is comprising top, middle and bottom parts. The middle part of the integrated MFC module which is consist of both the microvalve and sensing regions that is the key feature of the present invention. The microvalve is formed by depositing a heating element in a microbridge suspended on a mesa to control the movement of the valve. On the other hand, a series of sensing elements of the sensing region are in the mass flow path to detect the mass flow. The top and bottom parts are used for mass flow channel, mass entrance, mass exit and signal output terminals. There are bumps in the interface between middle and bottom parts to support the microvalve mesa. All three parts are first fabricated on a semiconductor wafer separately and then engaged together to complete the integrated MFC module formation.
REFERENCES:
patent: 4808009 (1989-02-01), Sittler et al.
patent: 5201221 (1993-04-01), Forgacs et al.
patent: 5994160 (1999-11-01), Niederman et al.
Chang Kuo-Ming
Chen Chien-Hung
Chou Min-Chieh
Tasi Ming-Jye
Fourson George
Industrial Technology Research Instititute
Liauh W. Wayne
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