Method for integrally packaging an integrated circuit with a hea

Details Method for integrally packaging an integrated circuit with a hea Method for integrally packaging an integrated circuit with a hea

1994-01-26

1995-10-31

Cuda, Irene

Metal working

Method of mechanical manufacture

Assembling or joining

29890036, 29890046, B23P 1500

Patent

active

054617669

ABSTRACT:
A method for minimizing thermal overhead in an integrated circuit package is described. A heat sink having a base is integrally formed into the package. The base is connected to the die, and a portion of the heat sink projects from the package, forming a post. A heat transfer assembly having a shaft with an aperture is heated until the aperture expands sufficiently to allow the heat transfer assembly to be fitted on the post with a minimum of force. Upon cooling, a tight joint is formed between the heat sink and the heat transfer assembly.

REFERENCES:
patent: 3868754 (1975-03-01), Kawano
patent: 4035007 (1977-07-01), Harrison et al.
patent: 4377894 (1983-03-01), Yoshida
patent: 4379009 (1983-04-01), Shibata et al.
patent: 4418453 (1983-12-01), Brown et al.
patent: 4555945 (1985-12-01), Hanson
patent: 4890195 (1989-12-01), Meckaman et al.
patent: 5056209 (1991-10-01), Ohashi et al.

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