Method for incorporating germanium into a semiconductor wafer

Details Method for incorporating germanium into a semiconductor wafer Method for incorporating germanium into a semiconductor wafer

2007-08-28

2007-08-28

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Introduction of conductivity modifying dopant into...

Fusing dopant with substrate

C257SE21466

Reexamination Certificate

active

10423184

ABSTRACT:
A method of fabricating a semiconductor wafer includes fabricating a gate electrode on a silicon substrate of the semiconductor device and incorporating germanium into the silicon substrate thereafter.

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