Method for improving the adhesion of a deposited metal layer

Details Method for improving the adhesion of a deposited metal layer Method for improving the adhesion of a deposited metal layer

1994-09-01

1996-01-23

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

134 3, 134 28, 1566621, 427309, 437228, 437238, H01L 2100

Patent

active

054862663

ABSTRACT:
The surface of a partially manufactured integrated circuit is cleaned by successive immersions in a series of specially formulated baths. Metallic films deposited on surfaces that have been cleaned in this manner do not exhibit subsequent peeling or blistering and have low electrical contact resistance to the surface onto which they were deposited.

REFERENCES:
patent: 5229334 (1993-07-01), Kato
patent: 5294570 (1994-03-01), Fleming et al.
patent: 5308400 (1994-05-01), Chen
Silicon Processing for VLSI Era vol. 1-Process Technology by S. Wolf & R. N. Tauber, pub by Lattice Press, 1986-Citation 4 "Kern & Puotin (RCA Review p. 187, Jun. 1970".
Silicon Processing for VLSI Era vol. 1-Process Technology by S. Wolf & R. N. Tauber, Pub by Lattice Press, 1986-Citation 10, "Vossen (J. Vac. Science & Technology, vol. A2, No. 2, 1984, p. 212)".

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