Method for improving semiconductor wafer processing

Details Method for improving semiconductor wafer processing Method for improving semiconductor wafer processing

1997-12-05

2000-01-04

Dutton, Brian

Semiconductor device manufacturing: process

With measuring or testing

Electrical characteristic sensed

G01R 3126, H01L 2166

Patent

active

060109165

ABSTRACT:
In the processing and handling of semiconductor silicon wafers, blank silicon wafers are replaced by chemically inert wafers during setup, adjustment, and operation. The inert material wafers eliminate the breakage associated with blank, silicon wafers while helping to purge the semiconductor wafer processing equipment of particulate contaminates.

REFERENCES:
patent: 5527707 (1996-06-01), Fukazawa
patent: 5709754 (1998-01-01), Morinville et al.
patent: 5762688 (1998-06-01), Ziger et al.

Affiliated with

Also associated with

Rating

Method for improving semiconductor wafer processing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for improving semiconductor wafer processing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for improving semiconductor wafer processing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1072104