Method for improving insulation resistance of printed circuits

Details Method for improving insulation resistance of printed circuits Method for improving insulation resistance of printed circuits

1990-03-20

1990-12-18

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

134 2, 134 27, 134 29, 156666, 156902, 252 795, C23F 100, B44C 122, C03C 1500, C03C 2506

Patent

active

049784226

ABSTRACT:
After the etching away of copper to selectively expose surface areas of insulating material in a printed circuit process based upon copper foil-clad insulating substrate material, the exposed surface areas of insulating material are contacted with an aqueous alkaline permanganate solution to remove from the areas residual metal species associated therewith so as to improve the electrical resistance afforded by those areas in the printed circuit.

REFERENCES:
patent: 4601783 (1986-07-01), Krulik
patent: 4601784 (1986-07-01), Krulik
patent: 4698124 (1987-10-01), Krulik

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