Method for improving adhesion of a resist layer to a metallic la

Details Method for improving adhesion of a resist layer to a metallic la Method for improving adhesion of a resist layer to a metallic la

1991-01-03

1992-08-18

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430275, 430277, 430278, 430279, 430314, 430315, 430318, G03C 500

Patent

active

051399237

ABSTRACT:
In conducting wiring by masking the portion other than the portion to be wired of a metallic laminate with a photoresist for plating and subjecting only the portion to be wired to pattern plating, the provision of a noble metal layer made of gold, platinum or the like, or a metallic layer made of a metal having a larger ionization tendency than that of a metal used in the pattern plating on the metallic layer constituting the undercoat of the photoresist for plating enables the peeling of the resist for plating to be prevented and excellent fine wiring to be conducted.

REFERENCES:
patent: 3450534 (1969-06-01), MacKellar et al.
patent: 3645772 (1972-02-01), Jones
patent: 4007295 (1977-02-01), Poliniak et al.
patent: 4756795 (1988-07-01), Bakos et al.
W. Foerst et al., Ullmanns Encyklopaedie Der Technischen Chemie, Third Edition, vol. 13, pp. 103-104, Urban & Schwarzenberg, Munich-Berline, 1962.
W. Foerst et al., Ullmanns Encyklopaedie Der Technischen Chemie, Third Edition, vol. 14, p. 636, Urban & Schwarzenberg, 1963.

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