Method for improved metal oxide bonding of optical elements

Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching

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216 34, 216 35, 134 11, 134 12, 134 13, H01L 21302

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active

061177946

ABSTRACT:
A method of preparing a supporting substrate of an optical subassembly for metal-oxide bonding an optical element to the substrate. The method includes providing a supporting substrate including a metalized region for metal-oxide bonding an optical element to the substrate and rinsing the substrate in a potassium hydroxide solution. The potassium hydroxide solution removes any excess metal oxide or other contaminants from the surface of the metalized region.

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patent: 4826272 (1989-05-01), Pimpinella et al.
patent: 4904036 (1990-02-01), Blonder
patent: 5312520 (1994-05-01), Chung
patent: 5437739 (1995-08-01), Hays

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