Method for heat-processing semiconductor device and apparatus fo

Details Method for heat-processing semiconductor device and apparatus fo Method for heat-processing semiconductor device and apparatus fo

1990-06-15

1992-09-29

Dixon, Joseph L.

Boots, shoes, and leggings

219457, 219464, H05B 368

Patent

active

051518716

ABSTRACT:
CPU stores information showing a time-temperature relationship and applicable for either heating a semiconductor wafer to a hold temperature for a predetermined period of time or cooling the wafer from the hold temperature over a predetermined period of time, or for both, read the information. A conductive thin film heats the wafer in accordance with the information. A sensor detects the temperature of the wafer. A control system controls either the heating of the wafer or the cooling thereof, or both, in accordance with the detected temperature signal and the information.

REFERENCES:
patent: 4481406 (1984-11-01), Muka
patent: 4504730 (1985-03-01), Shimizu
patent: 4688180 (1987-08-01), Motomiya
patent: 4690569 (1987-09-01), Veitch
patent: 4794217 (1988-12-01), Quan et al.
patent: 4881591 (1989-11-01), Rignall
patent: 4958061 (1990-09-01), Wakabayashi et al.
patent: 4982347 (1991-01-01), Rackerby et al.
patent: 5001327 (1991-03-01), Hirasawa et al.

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