Method for grinding semiconductor wafers

Details Method for grinding semiconductor wafers Method for grinding semiconductor wafers

2008-06-17

2010-02-23

Morgan, Eileen P. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Controlling temperature

C451S021000, C451S041000, C451S053000, C451S450000

Reexamination Certificate

active

07666064

ABSTRACT:
Semiconductor wafers are processed so as to remove material on one or both sides by means of at least one grinding tool, with coolant supplied into a contact region between the semiconductor wafer and the at least one grinding tool, characterized in that the coolant flow rate is set as a function of a grinding tooth height of the at least one grinding tool and this coolant flow rate is reduced as the grinding tooth height decreases.

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Patent Abstract of Japan corresponding to JP 58 143948 A.
Patent Abstract of Japan corresponding to JP 2250771 A.

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