Method for forming wiring on insulating resin layer

Details Method for forming wiring on insulating resin layer Method for forming wiring on insulating resin layer

2011-06-07

2011-06-07

Hoang, Tu B (Department: 3742)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S061000, C156S253000, C156S272800, C216S075000, C216S078000

Reexamination Certificate

active

07955454

ABSTRACT:
The method for forming wiring includes: laminating a thermosetting resin film and a metallic foil on an insulating substrate where base-layer wiring is formed, a mat surface of the metallic foil facing the resin film, pressing the film and the foil with application of heat; forming an opening in the metallic foil to expose a part of the insulating resin layer in which a via hole is to be formed; forming the via hole in the insulating resin layer by using as a mask the metallic foil; performing a desmear process of the via hole via the opening of the metallic foil; removing the metallic foil; forming an electroless-plated layer that covers the top surface of the insulating resin layer, a side surface of the via hole and a top surface of the base-layer wiring; and forming wiring including an electroplated layer on the electroless-plated layer.

REFERENCES:
patent: 3846166 (1974-11-01), Atsushi et al.
patent: 6197425 (2001-03-01), Sekimoto et al.
patent: 2004/0231141 (2004-11-01), Nishinaka et al.
patent: 2000-036662 (2000-02-01), None
patent: 2001-119125 (2001-04-01), None
patent: 2003-304068 (2003-10-01), None
patent: 2004055618 (2004-02-01), None

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