Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate
Reexamination Certificate
2006-06-13
2006-06-13
Meeks, Timothy (Department: 1762)
Coating processes
Direct application of electrical, magnetic, wave, or...
Pretreatment of substrate or post-treatment of coated substrate
C427S596000, C427S255600, C427S249100
Reexamination Certificate
active
07060330
ABSTRACT:
The present invention generally provides a method for depositing a low dielectric constant film using an e-beam treatment. In one aspect, the method includes delivering a gas mixture comprising one or more organosilicon compounds and one or more hydrocarbon compounds having at least one cyclic group to a substrate surface at deposition conditions sufficient to deposit a non-cured film comprising the at least one cyclic group on the substrate surface. The method further includes substantially removing the at least one cyclic group from the non-cured film using an electron beam at curing conditions sufficient to provide a dielectric constant less than 2.5 and a hardness greater than 0.5 GPa.
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U.S. Appl. No. 09/484,689, filed Jan. 18, 2000.
PCT International Search Report for PCT/US 03/14272 dated Jan. 21, 2004; AMAT/7034,PC.
Hollar Eric
Nemani Srinivas D.
Xia Li-Qun
Yim Kang Sub
Zheng Yi
Applied Materials Inc.
Meeks Timothy
Moser Patterson & Sheridan
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