Method for forming ultra fine deep dielectric isolation

Details Method for forming ultra fine deep dielectric isolation Method for forming ultra fine deep dielectric isolation

1980-03-17

1981-06-23

Massie, Jerome W.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29571, 29576W, 29578, 148 15, 148187, 156653, 156657, 1566591, 156662, H01L 2120, H01L 2122, H01L 21308

Patent

active

042749093

ABSTRACT:
A method is shown for forming ultra fine, deep dielectric isolation in a silicon body. The method involves forming a first layer of material on the silicon body over a first set of alternately designated device regions. A conformal coating is deposited over the first layer and on the silicon body included in a second set of alternately designated device regions and the designated isolation regions. The thickness of the conformal coating is chosen to be substantially the width of the planned isolation between device regions. A second layer is then deposited over the conformal coating. The first layer and conformal coating are composed of different materials. The topmost surface comprising of the second layer and the conformal coating is planarized by removing partially the second layer and conformal coating from the first layer wherein the second set of alternately designated device regions in the silicon body are covered by the conformal coating and the second layer with portions of the conformal coating separating the covers for the first and second set of device regions. The portions of the conformal coating separating the covers are removed down to the silicon body over the designated isolation regions. A groove is then etched in the silicon body using the covers as the etch mask. The groove is etched to the desired depth of the dielectric isolation in the designated isolation regions and then is filled typically by thermal oxidation.

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